一站式封裝服務
South Korea’s Samsung Electronics Co. has been chosen by Advanced Micro Devices Inc. to play a key role in manufacturing the US-based chip designer’s new Instinct MI300X accelerators.
韓國的三星電子公司已經被美國的超微半導體公司（AMD）選中，將在製造這家美國晶片設計公司的新Instinct MI300X加速器中發揮關鍵作用。
play a key role in扮演關鍵角色=play a critical role in=play a crucial role ininstinct(n.)直覺、天性、天份by instinct天生地、直覺地intuition(n.)直覺
This new artificial intelligence product, which is scheduled to be launched in the fourth quarter of 2023, will utilize both Samsung’s fourth-generation high bandwidth memory chip — the HBM3 — as well as its packaging services.
這款新的人工智慧產品預計於2023年第四季度推出，將利用三星的第四代高頻寬記憶體（HBM）——HBM3，以及其封裝服務。
artificial intelligence人工智慧=AIbe scheduled to do sth.預計要做某事情due(adj.)預計的;預期的launch(v.)推出(新產品或服務等)=roll out=unveilutilize(v.)運用;利用bandwidth(n.)頻寬
Although AMD has made a name for itself by developing central processing units that are used in servers, the creation of the Instinct MI300X marks the company’s expansion into AI accelerators, “which use chip packaging and machine learning technologies to process a large amount of data efficiently.”
儘管AMD以開發用於伺服器的中央處理器而聞名，Instinct MI300X的誕生標誌著該公司向AI加速器領域的拓展，該產品「使用晶片封裝和機器學習技術高效處理大量數據。」
make a name for oneself為自己打響名號central processing units中央處理器process(v.)處理(n.)過程expansion(n.)、expand(v.)擴展、拓展efficiently(adv.)有效率地effectively(adv.)有效(果)地
Samsung will help AMD make this leap by providing integral components and services.
三星將透過提供關鍵元件和服務來協助AMD實現這一跨足。
integral(adj.)必需的;不可或缺的component(n.)組成物、零件
The South Korean chip giant was selected by AMD over its rival Taiwan Semiconductor Manufacturing Company because Samsung is “the only company that can provide advanced packaging solutions together with HBM products.”
AMD相中韓國晶片巨頭三星，而不是競爭對手台積電，原因是三星是「唯一能夠提供高級封裝解決方案和HBM產品的公司。」
rival(n.)敵人、競爭對手rivalry(n.)競爭關係
This decision was made after both Samsung’s HBM3 chips and turnkey packaging services passed AMD’s strict quality tests.
此決定是在三星的HBM3晶片和一站式封裝服務都通過了AMD嚴格的品質測試後做出的。
strict(adj.)嚴格的=rigorousturnkey(adj.)完整並可立即使用的
Beyond this collaboration with AMD, Samsung’s other future prospects are also looking good.
除了與AMD的合作，三星的其他未來前景也看好。
beyond(prep.)除了～之外=in addition to=besidescollaboration(n.)合作=cooperationprospects(n.)成功的機會、前景career prospects事業前景employment prospects就業前景
Currently, the chipmaker is said to be working on finalizing a deal to contract the use of its HBM3 chips and packaging services to chip designer Nvidia Corp.
目前，三星據稱正在努力達成協議，將其HBM3晶片和封裝服務外包給晶片設計公司輝達。
contract(v.)外包=outsource
Additionally, Samsung is hoping to unveil a fifth-generation HBM chip — the HBM3P — by the end of 2023, while it aims to “more than double” its “current HBM production capacity and advanced packaging services next year.”
此外，三星希望在2023年底之前推出第五代HBM晶片——HBM3P，同時它還計劃「將明年的HBM生產能力和先進封裝服務增加一倍以上」。
unveil(v.)揭露、公布、揭幕aim to VR 計畫要=intend to VRcapacity(n.)生產能力、產能
According to tech market research firm Trendforce, such a manufacturing increase would likely lead to a 47-49% rise in Samsung’s market share from new cloud service provider orders.
科技市場研究公司Trendforce指出，這樣的生產增長可能會導致三星在新的雲端服務廠商訂單方面市佔率上升47-49％。
market share市佔率place an order for sth.下單訂購某物